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Heat dissipation board materials - List of Manufacturers, Suppliers, Companies and Products

Heat dissipation board materials Product List

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Heat-dissipating substrate material "Ag-Diamond" (Silver Diamond)

Heat-dissipating substrate material "Ag-Diamond" (Silver Diamond)

Stable thermal conductivity of over 600 W/(m·K)! Capable of high-temperature (800℃) silver brazing.

"Ag-Diamond" is a composite material of silver and diamond. It has a higher thermal conductivity (600W/(m·K)) than "Cu-Diamond" and is applicable for large area applications of 50×50mm². In addition to being able to be plated with Ni or Ni/Au on the surface, it also supports high-temperature (800℃) silver brazing. 【Features】 ■ Stable high thermal conductivity of over 600W/(m·K) ■ Surface can be plated with Ni or Ni/Au ■ Supports high-temperature (800℃) silver brazing *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Heat-dissipating substrate material "Yupicel(R) H"

Heat-dissipating substrate material "Yupicel(R) H"

By reducing the thickness of the insulation layer, high heat dissipation can be achieved! Ultra-thin heat dissipation substrate material.

"Yupicel(R) H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. 【Features】 ■ Ultra-thin heat dissipation substrate material ■ Super lightweight heat dissipation substrate material ■ Roll processing through a unique continuous manufacturing method ■ Three-dimensional processing capability ■ Halogen-free, UL94V-0 certified (E319042) (Contains no ceramic fillers, has good machinability, suitable for bare chip mounting COB) *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • LED lighting
  • power supply

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Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Ultra-thin, lightweight heat dissipation substrate without adhesive type! Since three-dimensional processing is possible, substrates of various shapes can be produced!

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be three-dimensionally processed, making it a suitable material for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ It allows for three-dimensional processing, enabling the production of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, providing excellent machinability. ■ It is suitable for bare chip mounting COBs. *For more details, please request materials or view the PDF data available for download.

  • aluminum

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Heat-dissipating substrate material "Cu-Diamond/Cu-W submount"

Heat-dissipating substrate material "Cu-Diamond/Cu-W submount"

For laser diodes! A lineup of materials with various thermal expansion rates and thermal conductivities.

We handle the heat dissipation substrate material "Cu-Diamond/Cu-W Submount." Sharp edge processing and AuSn deposition are possible. We offer a lineup of materials with various thermal expansion coefficients and thermal conductivities. "W-10T" has achieved a high thermal conductivity Cu-W submount while maintaining low thermal expansion equivalent to conventional materials through our unique immersion technology. 【Features】 ■ High thermal conductivity ■ Cu-Diamond submount > 500 W/(m·K) ■ High thermal conductivity Cu-W submount realized (W-10T) ■ Lineup of materials with various thermal expansion coefficients and thermal conductivities ■ Sharp edge processing and AuSn deposition are possible *For more details, please refer to the PDF document or feel free to contact us.

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